Dynatron 88885063 Datasheet

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DYNATRON CORPORATION
NEW PRODUCT SPEC SHEET
R-th
0.32
0.35
0.38
0.41
0.44
11 14 17 20
Airflow (CFM)
Thermal Resistance (c/w)
R-th
Part Number: G129
For Intel® Nehalem Processor, Socket LGA 1366
Passive Heat Sink For Blade & 1U Server
RoHS Compliant
Overall Specification:
Dimension: 90.0mm x 88.0mm x 23.5mm
Weight: 465g ±5g
Material: Copper Heat Sink with Skiving Fins
Captive mounting design
Back Plate is not included
Thermal Grease TIG830SP Pre-printed
Thermal Power up to 95Watts
G129 Cooling Performance VS. System Airflow :
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Summary of Contents

Page 1 - DYNATRON CORPORATION

DYNATRON CORPORATION NEW PRODUCT SPEC SHEET R-th0.320.350.380.410.4411 14 17 20Airflow (CFM)Thermal Resistance (c/w)R-th Part Number: G129 • For I

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